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​受付時間 9:00~18:00 
直通電話 090-6819-5609

mail:connection.fukui@gmail.com

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Palladium plating details

Regarding the expansion of applications for palladium plating (Pd plating), the effect of thinning the plating thickness of electronic components, especially nickel plating as a diffusion barrier for copper, is large.

For example, nickel / gold plating specifications for copper-based lead frames and connectors initially required plating specifications of nickel 5 μm and gold 1 μm, but post-processing with finer wires and extreme deformation due to higher density of crab paths. From the viewpoint of responding to the problem and reducing costs, nickel plating is becoming thinner (about 1 μm).

By thinning the nickel plating, the function of the pinholes present in the nickel plating as a diffusion barrier of copper is significantly reduced.

To make up for this, thin palladium plating of 0.1 μm or less was performed on nickel plating, and the gold plating on the top layer could be made thinner, leading to the expansion of industrial applications.

It is a silver-white (silver-colored) film that is mainly used as a base for gold plating. It is also used as a substitute for expensive rhodium plating because it is the cheapest and has the lowest specific gravity among white metals.

Pure palladium plating is used for decorative purposes as it also serves as a countermeasure against metal allergies (nickel allergies).

Pure palladium plating (Pd 99.9%)

Actual maximum film thickness 4 μm

Can be used for thick film processing without cracks.

Silver appearance, electrical conductivity, low contact resistance,

Corrosion resistant Used to prevent metal allergies.

* Some people rarely develop allergies.

Palladium plating heat resistance

Palladium plating characteristics (solder wettability)

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Zero cross time 1.25 / sec

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ご質問回答
  01 

Q. SCM440We are considering palladium plating for our products. Is it possible?

A. Palladium plating cannot be applied directly to the SCM440 material, so it is necessary to apply electrolytic nickel plating or electroless nickel plating to the base, but palladium plating is possible.

  02 

Q. I would like to process pure palladium plating of 2 μm or more. Is this possible?

A. Although it is pure palladium plating, it can be used for 2 μm or more (we have a track record of up to 4 μm).

  03 

Q. I would like to partially apply palladium plating. Is it possible to handle masking etc.?

A. Palladium plating masking is available.

If you send us a drawing that shows the shape etc., we will check whether it can be processed.

  04 

Q. Is it possible to change from gold plating of products that have been gold-plated by other companies to palladium plating?

A. It is possible to change from gold plating to palladium plating.

Depending on the condition, palladium plating can be processed on top of gold plating, or it is possible to remove only gold plating and change to palladium plating.

  05 

Q. Is it possible to plate the SUS630B-H900 material with palladium plating?

A. Palladium plating on SUS630B-H900 material is possible.

Please let us know the shape, size, quantity, etc. as there are restrictions on the size.

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Connection Co., Ltd.

Please feel free to contact us for plating, coating, polishing, heat treatment, etc.

Consultations and quotations are free.

​4-202-5 Shizugaoka, Fukui City, Fukui Prefecture 910-3635 (Japan)

​Reception hours 9: 00-18: 00 

Direct phone 090-6819-5609

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