Details of copper plating
The copper plating film obtained by electroplating varies depending on the additives and plating type, but the film hardness is about HV50 to 200.
The hardness of the plating film is about twice that of the copper material hardness of about HV50-100.
Since the processing uses an external power supply, the plating film thickness also differs due to the difference in current flow between the tip of the product where current tends to concentrate and the recessed part where current does not easily reach, so an external power supply is not used. Although it is inferior in uniform electrodeposition to electroless plating, it has many advantages over electroless plating that does not use an external power source.
Practical example of copper plating film
① Base plating
It is used for base plating of Ni, Ni-Cr, Sn, etc.
It is also used as a base plating for materials that dissolve in acid.
② Manufacture of copper foil
It is also used in the manufacture of copper foil used for copper-clad laminates.
③ Circuit formation
Copper plating with good conductivity, physical properties, and leveling is used for electricity (printed wiring board, induction coil) and electronic circuit (copper damascene).
It is also used in the manufacture of waveguides, stampers, partial coating masks, rocket nozzles, and thick plating on the rollers of printing presses.
⑤ Carburizing prevention
When surface hardening of ferroalloy machine parts, it is used for the purpose of covering unnecessary parts with copper plating to prevent carburizing of exposed parts.
⑥ Thermal conductivity
It is used for the purpose of giving thermal conductivity by plating the bottom of iron pots and stainless steel pots with copper.
Characteristics of copper-plated film
Q. We are considering nickel plating or copper plating for the purpose of imparting conductivity to 30 μm ceramics.
The film thickness is about 1 μm, is it possible?
A. It may be possible to handle it by processing it in a small container.
We would appreciate it if you could make a prototype.
Q. Is it possible to apply copper plating after plating the base nickel on the S10C equivalent product?
(Aiming for a total film thickness of 50 μm)
A. We can handle two-layer plating of nickel plating and copper plating.
We can also handle the film thickness.
Q. Is it possible to remove the nickel plating and copper plating of the zinc die-cast material and re-decorate the nickel chrome plating?
A. Depending on the size, both nickel-plated and copper-plated zinc die-cast materials can be peeled off and redecorated with nickel-chrome plating.
Q. Is it possible to support copper plating (10 μm) for products in which SUS304 and Fe-Ni-Co alloy are bonded?
Only the specified part will be partially plated.
A. Our copper plating cannot be used for SUS material and Fe-Ni-Co alloy plating, so it is possible to use copper plating after nickel plating the base.
We would appreciate it if you could confirm the possibility of masking even if only the specified part is plated.
Q. I have applied a copper strike to the naval brass, but it has peeled off and swelled.
Copper strikes are applied to other iron-based materials in the same process, but no peeling or swelling occurs.
The difference is unknown, but is there a possible cause?
A. If both naval brass and iron-based materials are treated in the same process, the pretreatment may not be appropriate.
I think it will be improved by reviewing the pre-processing.
Q. I would like to apply copper plating to the zinc die-cast (zinc die-cast: ZnDC) material. Is this possible?
A. Copper plating is available for zinc die-cast materials. Please tell us the specified film thickness.
Q. Is it possible to apply a flexible and thick copper plating with copper plating?
A. It is possible. There are acidic copper plating and alkaline copper plating for copper plating, but if you want to apply thick copper plating with high flexibility, I think that alkaline copper plating is suitable.
Please note that the highly flexible copper plating has a matte appearance, which makes it unsuitable for decorative purposes.
Q. I have copper plating to prevent carburizing, but it seems that carburizing is not sufficiently prevented.
What are the possible causes?
A, For copper plating for the purpose of preventing carburizing, a copper plating thickness of 25 μm or more is required.
It is said that the purpose of preventing carburizing is not sufficiently achieved, so the film thickness is not sufficient or the copper plating film is porous.
Q. Roughness occurs after copper plating.
Plating dust is cleaned by reopening and filtering, and microfiltration is also performed.
The plating bath is alkaline copper plating.
A. The cause of roughness in the absence of metal impurities in the plating solution may be roughness due to the introduction of chloride from the pretreatment for alkaline copper plating.
If the chloride concentration in the plating solution is confirmed and increases, it is considered effective to reduce the chloride concentration by removing the chloride or renewing the solution.
Q. If you re-plat a product that was used outdoors, pits (macroscopic holes) may occur.
I would like to suppress the occurrence of this pit, is there a way?
A. Since it was a re-plating of a product that was used outdoors, the substrate was corroded during outdoor use, creating burrows in the material, and the corrosion caused pits. I can think of it.
Since the pits are caused by the burrows of the material, remove the burrows of the material as much as possible by polishing.
Since it is difficult to completely remove the burrows, the pits are suppressed during the final finish by thickening the copper plating and polishing the pits with buffing.
Q. Another company treats copper plating (copper phosphate copper plating). Previously, it was treated as a whole, but recently there are some parts that have not been partially deposited. I think there may be problems with the treatment method, but is there any problem with the plating solution?
A. Since it is copper pyrophosphate plating, it is considered that the P ratio (pyrophosphate / copper) and PH values are out of control, and the brightener and ammonia are excessive. Excess brightener can be removed with activated carbon. If there is an excess of ammonia, hydrogen peroxide can be added to reduce it.
Q. I heard that there is a bath called Rossel salt bath. Is it commonly used?
A. In the past, it was used for plating on zincated aluminum, but recently the zincating process has changed.
Since it has become possible to handle electroless nickel and direct electrolytic nickel plating after the zincate treatment, I have not heard that I am using the Rossell salt bath recently.
We do not offer Rossel salt baths either.
Q. I am considering a half-wave rectifier for copper plating. Is there any problem?
A. A half-wave rectifier is suitable for acidic copper plating, but we recommend using a full-wave rectifier for alkaline copper plating.
Q. Is copper plating possible for Φ4mm x 1300mm SUS shafts?
A. Copper plating is available in terms of material and size.
However, it is necessary to hold the product, and the parts of about 10 mm at both ends will be tied up with copper wire etc. for processing.
Please note that the tied parts will not be plated.
Also, please let us know if you have the specified film thickness.
Q. Is it possible to apply copper plating (or brass-like color) to a mild steel wire (nickel-plated) ring (inner diameter of about 40 mm)?
A. It is possible to plate the ring of nickel-plated mild steel wire with copper or brass, but if the purpose is designability, the plating will cause discoloration, so it is necessary to apply clear paint.
If clear paint cannot be used, gold plating does not require clear paint.
The color is close to brass, but how about it?
Q. There are products with copper plating on the aluminum material (A5052). Is it possible to peel off the copper plating film? Is it possible to make the material as rough as possible?
A. It is possible to peel off the copper plating without roughening the aluminum material as much as possible.
Since there are size restrictions, please tell me the product size etc.
Q. Is it possible to handle copper plating (about 100 μm) on MoMn metallize?
A. Test processing is required, but we believe that processing is possible.
Q. We are considering copper plating on nickel silver (copper, nickel, zinc).
Do you have any processing results?
A. We have a track record of processing copper plating on nickel silver.
We can handle it without any problems.
Please tell us about the shape, size and quantity of the product.
Q. Cermet A composite material made by mixing powders of hard compounds such as carbides and nitrides with metal binders and sintering them.
We are thinking that we can reduce the brittleness by applying copper plating.
Is it possible to plate the cermet material with copper?
A. It is necessary to actually perform the treatment and evaluate the brittleness, etc., but it is possible to process the cermet material with copper plating.
We would appreciate it if you could evaluate it while performing prototype processing.
Q. I would like to apply electroless copper plating to alumina nitride ceramics (AIN). Can it be processed?
A. We have a track record of electroless copper plating on alumina nitride ceramics (AIN) in the past, but the reaction may occur depending on the material.
Since it is different, we will perform prototype processing in advance, and it is necessary to confirm whether it can be processed.
Since scraps are fine, you can check the test conditions if you prepare a material that can be used for setting conditions.
Q. I would like to apply copper plating to zinc die-cast (ZnDC). Is this possible?
A. We have a track record of processing copper plating for zinc die casting in the past.
It can be processed without any problem.
We would appreciate it if you could send us materials that show the shape of the product.
Q. Is it possible to apply matte copper plating to stainless steel (SUS304)?
A. Stainless steel can be plated with matte copper.
The matting method is matting with shot blast.
Q. It is a product made of iron material shaped like a small button, but there are many and there are no holes for hanging, but copper plating is
Is it possible?
A. Since it is a small button shape, it can be handled by barrel plating (plating in a special container).
Since barrel plating can process a large number of products at once, it has the advantage of being cheaper than rack processing (holding and processing each product one by one).
The disadvantage is that the products collide with each other in the container, resulting in scratches and dents.
Q. Is it possible to process with copper plating (aiming at 30 μm) on Mo-Mn metallize?
A. Copper plating on Mo-Mn metallize is available.
Please let me check the size, shape, quantity, etc.
Q. We are considering electroless copper plating for the purpose of making ABS resin conductive.
Is it possible to process it?
A. Electroless copper plating on ABS resin is available, but plating grade ABS (natural color) is available.
Connection Co., Ltd.
Please feel free to contact us for plating, coating, polishing, heat treatment, etc.
Consultations and quotations are free.
4-202-5 Shizugaoka, Fukui City, Fukui Prefecture 910-3635 (Japan)